Subdivision platting is the process by which a large area of land is divided
into several smaller areas called lots and blocks. In addition to lots and blocks, part of the land is
also usually dedicated to the governing body as public right of way (usually streets and alleys).
Subdivision platting is a relatively lengthy process, and generally begins with a
boundary survey of the tract of land which is to be divided and platted. After the boundary survey is
completed, a topographic survey usually follows, in order to determine the relief of the land and to show other
features that will be important during the planning phase.
Once the boundaries have been determined and the relief and other features have been
identified, the planning process begins. The planning process is when the size, shape, and number of
the lots is determined, and the initial proposed layouts are submitted to various governing entities (county
commissioners, city councils, etc.) for approval.
Upon approval of the preliminary plat, the final designed layout is staked in the field,
and the official plat is drawn. Once all of the interested parties have signed the plat, and the
finalized version has been approved, the plat is recorded and goes into effect.